JCET Group
Noel Tiglao is an experienced engineering professional with expertise in equipment maintenance and optimization within semiconductor and manufacturing environments. Currently serving as a Test Equipment Engineer at Ecomicron Inc. since October 2022 and a Senior Associate Engineer at STATS ChipPAC Ltd. since September 2019, Noel has a background that includes over a decade at Texas Instruments as an Equipment Engineer and previous roles at Deca Technologies and Pythos Technology. Noel’s technical skills encompass handling and maintaining various thin film module sputtering equipment, implementing machine improvements, and conducting preventive maintenance, coupled with a solid foundation in computer engineering from Angeles University Foundation.
This person is not in any offices
JCET Group
JCET Group is the world’s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services that include semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to vendors around the world. Our comprehensive portfolio covers a wide spectrum of semiconductor applications such as mobile, communication, compute, consumer, automotive, and industrial, through advanced wafer-level packaging, 2.5D/3D, System-in-Package, and reliable flip chip and wire bonding technologies. JCET Group has two R&D centers in China and Korea, six manufacturing locations in China, Korea, and Singapore, and sales centers around the world, providing close technology collaboration and efficient supply-chain manufacturing to our global customers.