JCET Group
Yongzhi Zhang is an experienced engineering professional with a strong background in quality assurance and process integration. Since 2018, Yongzhi Zhang has served as a Senior Customer Quality Engineer at STATS ChipPAC Ltd. Prior experience includes a role as a Senior Quality Assurance Engineer at United Microelectronics Corporation from 2013 to 2017 and as a Senior Process Integration Engineer at GLOBALFOUNDRIES from 2005 to 2011. Yongzhi Zhang began the career as a Process Integration Engineer at 中芯国际 from 2003 to 2005. Educational credentials include a Bachelor's degree in Electronics from Xi'an Jiaotong University, obtained from 1999 to 2003.
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JCET Group
JCET Group is the world’s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services that include semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to vendors around the world. Our comprehensive portfolio covers a wide spectrum of semiconductor applications such as mobile, communication, compute, consumer, automotive, and industrial, through advanced wafer-level packaging, 2.5D/3D, System-in-Package, and reliable flip chip and wire bonding technologies. JCET Group has two R&D centers in China and Korea, six manufacturing locations in China, Korea, and Singapore, and sales centers around the world, providing close technology collaboration and efficient supply-chain manufacturing to our global customers.