Wei Huang, Ph.D., is a Senior Staff Engineer at JETCOOL Technologies Inc., focusing on advanced engineering technologies. An accomplished Research Engineer and Senior Research Engineer at HP, they pioneered innovative 3D printed cooling solutions for data centers and led numerous successful engineering projects. Wei's extensive expertise encompasses CAD, thermal analysis, CFD modeling, and FEA, complemented by over 50 granted or pending patents. They previously served as a Teaching Assistant and Research Assistant at Georgia Institute of Technology, contributing to NSF projects on next-generation CAD/CAE systems. Wei holds a Ph.D. in Mechanical Engineering from Georgia Institute of Technology and degrees in Mechanical and Aircraft Manufacturing Engineering from Beihang University.
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