Zack MacLennan

Zack MacLennan has extensive experience in hardware engineering, particularly in PCB layout and design. Zack currently works at Kepler Communications Inc. as a Hardware Engineering Manager, where they lead a team in designing circuit board assemblies for LEO satellites. Their expertise includes PCBA DFM, DFA, and DFT, with a focus on delivering robust and reliable designs. Prior to this role, Zack worked as a Senior PCB Layout Engineer at Kepler Communications Inc., overseeing the development of flight PCBAs for next-generation satellites. Zack utilized Altium Designer in designing PCBAs ranging from 2-4 layer FR-4 boards to complex 20+ layer HDI designs.

Before joining Kepler Communications Inc., Zack worked as a PCB Layout Designer at Google via Adecco, where they contributed to layout design projects. Zack also served as a Senior PCB Layout Engineer at ecobee, taking on sole responsibility for designing and managing PCBAs for ecobee's products. Zack excelled in optimizing layouts for cost and achieved EMC compliance.

Zack has additional experience as a self-employed PCB Designer and as an Electrical Engineering Designer at North, where they played a key role in designing and shipping products such as the Myo armband and the earliest prototypes of Focals smart glasses. Their time at North taught him to think outside the box and push the boundaries of hardware design.

Earlier in their career, Zack worked as an Electrical Engineering Lead at Grobo Inc., managing the development of electrical programs for the Grobo One hydroponic grow box. Zack also gained experience as a Hardware Engineering Co-op at Facebook, Avvasi Incorporated, and Kaleidescape, where they contributed to various hardware design projects and developed internal tools.

Overall, Zack MacLennan's work experience showcases their expertise in hardware engineering, particularly in PCB layout and design, as well as their ability to lead and manage teams in delivering high-quality designs.

Zack MacLennan completed their Bachelor of Applied Science degree in Computer Engineering from the University of Waterloo, where they studied from 2008 to 2013. In addition to their degree, they have obtained certifications in the field of interconnect design. In September 2013, they became a Certified Interconnect Designer (CID) from the IPC Designers Council. Later, in April 2018, they achieved the Advanced Certified Interconnect Designer (CID+) certification from the same institution.