William Corbin

Lead, Engineering Services

William Corbin possesses extensive experience in engineering services, currently serving as Lead in Engineering Services at L3Harris Technologies since October 2017. Prior to this role, William held various positions including Senior Microwave Test Engineer III at L3Harris Technologies and Senior Associate at Fisica, Inc. William has been involved with Fisica, Inc. and Randtron-Fisica since May 1992, taking on leadership responsibilities in engineering services. Earlier in William's career, experience was gained at Exelis, where roles included Engineer II, and at EM Systems as an Antenna Engineer Associate. William's educational background includes studies at the Georgia Institute of Technology and California State University-Northridge.

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