Jing Yang is currently serving as Group CFO at Lisconn since October 2023. Prior to this role, Jing held the position of Finance VP and Asia CFO at Oatly from May 2021 to May 2023. Jing's experience also includes working as an Operating Principal at Hillhouse Capital Management from August 2019 to May 2021. At TE Connectivity, Jing was a Finance Director overseeing various roles from November 2011 to August 2019, including leading the Lean Business System initiative across all finance functions and managing the financial operations of the Energy Business Unit in Asia. Additionally, Jing served as a Senior Treasury Manager for Capital Planning at Tyco International from January 2005 to April 2007. Jing holds an MBA in Finance and Strategy from Yale School of Management and a Master’s degree in International Finance from Tsinghua PBCSF.
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Lisconn | Interconnect, Integrated Technology & Turnkey Electronics Design & Manufacturing
1-978-970-1200 | www.lisconn.com Lisconn is a one-stop design and manufacturing partner delivering exceptional value to customers around the globe for complex electronic products in highly regulated and demanding industries. Lisconn is a customer-centric company with engineering-led solutions that adapt to our customers’ needs, enabling you to remain focused on winning in your marketplaces. We have over 1K engineers and an end-to-end offering from component design to custom interconnect to complex product integration to global order fulfillment for multinationals with supply chains in North American, European, and Asian markets. Formed through the merger of Lorom, In-Tech Electronics, and Segue Manufacturing Services, Lisconn is an expert partner in low-medium volume, low-high mix, high-complexity products with 100+ years of design, engineering and manufacturing expertise. High-Reliability Industries • Medical Devices & Instrumentation • Aerospace • Industrial & IA • Automotive & Marine • Capital Equipment & Semiconductor • AI and IoT • Cleantech & Smart Buildings • Professional & Consumer Electronics Engineering & Manufacturing Capabilities from Rapid Launch to Rapid Scale • Component Design & Development, including Industrial IoT Devices • Product Design & Development • Bespoke Wire, Cable & Interconnect Products • Value Engineering • NPI, Prototyping & Quick-Turn • Complex Cable & Wire Harness Assembly • Low-to-High-Volume PCBA • Complex Electromechanical Assembly • Full Integration & Turnkey Solutions • Repair & Refurbishment Global Manufacturing & Fulfillment: 9 Facilities in 5 Countries • Boston, USA • Tijuana, Mexico • Penang, Malaysia • Xiamen, China • Shenzhen, China • Hangzhou, China • Jiangxi, China • Dongguan, China • Rajasthan, India Designed-In Quality & Lean Manufacturing • ISO 9001, ISO 13485, ISO 14001, ISO 45001 • IATF 16949 • AS9100 • MedAccred for Cable & Harness • ISO 14644 Clean Room • ISO 17925 Testing • ITAR-Registered