Sam Kuan

Sam Kuan is a seasoned thermal engineer with extensive experience in the field, currently serving as Lead Thermal Engineer at Logitech since May 2019, where responsibilities include leading thermal architecture for video collaboration products and webcams. Prior experience includes roles as Thermal Technical Manager at ASUS, where product development spanned smartphones and notebooks, and Senior Thermal Engineer at Pegatron, overseeing thermal design for major clients like Acer and HP. Kuan also held a Thermal Engineer position at Flextronics, specializing in notebook thermal design, and began a career in thermal engineering at Auras Technology Co., designing heatsinks for various electronic devices. Educational credentials include a Master of Mechanical and Automation Engineering and a Bachelor of Science in the same field, both obtained from Da-Yeh University.