Chun Lei

Chun Lei has extensive experience in the technology industry, with a focus on wafer fabs and operations. Chun currently holds the position of Group Vice President of Global Wafer Fabs at Lumentum since January 2023. Prior to this, they served as the Vice President of Operations, US Wafer Fabs at Lumentum from April 2021 to December 2022, and as the Vice President of Operations, 3D Sensing from October 2018 to March 2021. Before joining Lumentum, Chun Lei was a Senior Director of Engineering, 3D Sensing at Lumentum from July 2017 to September 2018. Chun Lei also has experience at other companies, including Emcore Corp, where they were the Vice President of Wafer Fab R&D and Operations from May 2008 to June 2017. Chun was also a Senior Engineering Manager at Intel Corp from 2005 to 2008. Chun Lei started their career at Hewlett-Packard as an R&D Section Manager from 1993 to 1999.

Chun Lei holds a Doctor of Philosophy (Ph.D.) in Electrical Engineering from The University of Texas at Austin. They also obtained a Master's degree in Electrical Engineering and a Master's degree in Physics from The University of Texas at Arlington.