Jack X is a Mechanical Engineer with extensive experience in the development of high power laser packages at Lumentum since 2013, focusing on applications in 3D sensing, telecom, datacom, satcom, and material processing. Prior to this role, Jack X contributed to the development of the motion stage for 450mm wafer inspection tools at KLA-Tencor from 2011 to 2013. Jack X also has a background in mechanical design and development of 2.5" form factor enterprise and mobile hard disk drives at Western Digital, where employment lasted from 2005 to 2011. Jack X holds degrees from The University of Texas at Austin and Shanghai Jiao Tong University.
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