Carlos MacIas

Carlos Macias has extensive work experience in the semiconductor industry. Carlos started their career as an Assembly Engineer at Rockwell Semiconductor Systems in 1997. Carlos then joined Conexant Systems in 1999 and continued to work as an Assembly Engineer. In 2002, they moved to Mindspeed Technologies and took on roles such as Packaging Engineer, Advanced Packaging Manager, and Packaging Technologies Director. In 2013, Carlos joined MACOM as a Senior Director of Operations, responsible for engineering teams and supporting Wafer Foundry, Assembly, and ATE Test Operations. Carlos was later promoted to Vice President, OSAT Operations, where they directed all manufacturing activities with OSAT partners and engineering sustaining activities with external and domestic wafer fab partners.

From 1990 to 1994, Carlos Macias attended Universidad Autónoma de Baja California. No degree or field of study details were provided.