Jack Chiang

Jack Kai-Chieh Chiang is a Staff Engineer in IC Package Engineering at Marvell, with over 8 years of experience in advanced mechanical and manufacturing fields, including 5 years focused on semiconductor packaging and heterogeneous integration. They possess expertise in new product development, mechanical design, and reliability optimization, underscored by their leadership in R&D projects. Currently enrolled in the Mechanical Engineering PhD program at Purdue University, sponsored by the Semiconductor Research Corporation, Jack also has a history of impactful roles, including positions at Texas Instruments and Nokia, where they significantly improved production yields and process efficiencies. They earned a Master’s degree in Mechanical Engineering from National Taiwan University and a Bachelor's degree from National Tsing Hua University.