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YH Huang is a skilled product engineer with extensive experience in the semiconductor industry, currently working at 聯發科技 since March 2024, focusing on post-silicon validation and NPI yield for digital CPU ICs. Prior to this role, YH Huang contributed to RichWave Technology Corp as a product engineer, specializing in HEMT, HBT, and SOI Si MOSFET technologies, and worked on RF IC products from March 2021 to March 2024. Previous experience includes a role at uPI Semiconductor Corp from June 2019 to March 2021, where YH Huang was involved with HV Logic IC, Power Si Trench MOSFET, and GaN-FET projects, and as a process integration engineer at 世界先進積體電路股份有限公司 between February 2018 and June 2019, focusing on driver IC processes. YH Huang holds a Master’s degree in Electronic Engineering from National Cheng Kung University, obtained in 2016.
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