Liang Wang is an accomplished engineer with extensive experience in materials and process engineering, particularly within the optical film and electronics industries. At IC Interconnect, Liang led a team to develop cost-effective wafer level chip scale packaging processes and established an analytical lab. Subsequent roles include serving as a Senior Panel Process Engineer at Apple, where innovations included new optical films and defect inspection solutions, and currently as a Staff Process Engineer at Meta, focusing on diffractive optical films for AR/VR applications. Liang also has a rich academic background with a Ph.D. in Polymer/Plastics Engineering and has contributed to research and mentorship at various educational institutions.
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