Smile Peng is an accomplished software engineer and researcher with a Bachelor of Applied Science in Engineering Science from the University of Toronto, graduating in 2023 with a notable GPA of 3.83/4.0. Experience includes a role as a Research Assistant at the University of Ottawa, where Smile independently led investigations on Silicon Nitride chips, optimizing data analysis for nanopores, and performing quality control testing. Positions at Intel Corporation involved designing an API package and enhancing the Engineering Change Order Toolkit, significantly improving design processes. At Meta, Smile has contributed as both a Software Engineer Intern and currently as a Software Engineer, focusing on ads ecosystems and machine learning solutions to enhance user engagement. Additionally, Smile has experience in automating FPGA programming processes during a research assistantship at the University of Toronto, awarded the NSERC USRA for outstanding academic performance.
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