Wendem B. is a distinguished lecturer and expert in signal and power integrity, with extensive experience in the design and analysis of chiplet interfaces and high-performance memory systems. Currently serving as a distinguished lecturer for the EPS - IEEE Electronics Packaging Society since July 2020, Wendem has previously held significant engineering roles at Intel Corporation as a Principal Engineer/Manager and at Facebook as an Analog & Mixed Signal Architect. Additional experience includes teaching at the University of California at Santa Cruz and contributing as a technical director at Rambus Inc. Wendem holds a Master of Science and a Bachelor of Science in Electrical Engineering from Columbia University, as well as a Ph.D. in Electrical and Computer Engineering from the University of Illinois Urbana-Champaign.
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