Balamurali HS is currently a Senior Package Design Engineer at Micron Technology, a position held since 2022. They previously worked as a PCB Design Engineer at Tessolve Services Pvt. Ltd. from 2012 to 2023, and have held various engineering roles in companies such as Advanced Micronic Devices Ltd, Spanwave Technology Solutions Pvt. Ltd., KAMAL Elektronix Pvt. Ltd., and others, accumulating extensive experience in PCB design, application engineering, and technical support. Balamurali's career spans a range of technical roles, beginning as a Technician in the early 2000s and advancing to leadership positions in design engineering.
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