Cheng-Ting Yang

Cheng-Ting (Michael) Yang is a skilled professional in materials science, holding a Master's degree from UCLA and a Bachelor's degree from National Tsing Hua University. Experience includes an undergraduate researcher role at National Tsing Hua University, where significant advancements in atmospheric plasma applications for agriculture were achieved. Cheng-Ting interned at the Industrial Technology Research Institute, focusing on advanced alloy processing and biodegradable materials. As an intern at KLA, contributions were made in application development, including machine learning applications in optical critical dimension simulation. At National Taiwan University, hands-on research involved innovative techniques in chip packaging. Currently, Cheng-Ting serves as a Graduate Researcher at UCLA, working on process development for advanced chip technologies, while concurrently working as a Package Design Engineer at Micron Technology since October 2024.