Ken Ye

Ken Ye is an accomplished engineering professional with extensive experience in chip integration and design verification. Currently serving as Chip Integration Lead at Micron Technology since November 2020, Ken Ye previously worked as a Principal/Technologist Engineer at Western Digital, focusing on SoC design integration for 3D NAND technology. Ken Ye has also held positions as Hardware Engineer Manager at Microchip Technology Inc., where responsibilities included UVM verification and RTL modeling, and as Staff Design Engineer at ATMEL, engaging in design verification and integration of nonvolatile memory systems. Ken Ye holds a B.S. in Electrical Engineering and Computer Science from the University of California, Berkeley and a M.S. in Engineering Leadership and Management from Santa Clara University.