Nicholas Clore is a Senior Manager in HBM System Engineering and Customer Enablement at Micron Technology, a position held since 2024. Previously, they served in various engineering roles, including NVE/NAND Product Engineer and Advanced Packaging Technology Development Characterization Engineer at Micron. They started their career as a Research Assistant at Purdue University and later worked as a Packaging Quality & Reliability Engineer at IBM. Nicholas holds a Master of Science in Materials Engineering from Purdue University Calumet and a Bachelor of Science in Materials Engineering from Purdue University.
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