Michel de Langen

Michel de Langen has extensive work experience in the semiconductor industry. Michel is currently working as an IC Assembly and Packaging Engineer at Mini-Circuits since June 2021. Prior to that, they worked at Ampleon from December 2015 to May 2021 as an Assembly Engineer, where they were responsible for developing new assembly processes and installing production lines.

Before joining Ampleon, Michel worked at NXP Semiconductors from January 2009 to December 2015 as an Assembly Engineer and from July 2005 to January 2009 as a Program Manager. At NXP Semiconductors, they gained experience in both technical roles and managerial positions.

Prior to NXP Semiconductors, Michel worked at Philips Semiconductors, specifically in the Imaging and Optical Networking divisions. From January 2003 to July 2005, they worked as a Project Manager in the Philips Semiconductors, Imaging division. From January 2001 to January 2003, they served as an Assembly Manager in the Optical Networking division, where they were responsible for packaging high-speed communication products.

Michel started their career at Philips Semiconductors in 1993 and worked there until 2001. During this period, they held the role of Group Manager Advanced Package Development.

In summary, Michel de Langen has a diverse background in the semiconductor industry, with experience in various technical and managerial roles, specializing in assembly and packaging engineering.

Michel de Langen attended the University of Twente from 1980 to 1986, where they obtained a Master of Science (M.Sc.) degree in Engineering Physics/Applied Physics.