Reid Chesterfield

Reid Chesterfield is an accomplished technology executive with extensive experience in innovation and commercialization within the chemical engineering and materials science sectors. Currently serving as the Chief Technology and Innovation Officer at Miraclon Corporation since January 2021, Reid focuses on driving new value in flexographic technology. Previously, as Global R&D Director for Thermal Management at Henkel, Reid led a significant thermal materials management platform, overseeing over 20 product launches in diverse applications including 5G Telecom and electric vehicles. Reid's career also includes roles at DuPont, where responsibilities ranged from managing a materials discovery team to directing R&D programs for OLED technologies, as well as early engineering roles at Dow. Educational credentials include a PhD in Chemical Engineering from the University of Minnesota and a BS in Chemical Engineering from the University of Washington.