Zvi Or-Bach

Or-Bach is a world recognized expert in monolithic 3D technologies with over 100 patents in the space, the chairman of the 3D of IEEE S3S Conference, and is active as an invited speaker and tutorial instructor in the USA, Korea, and Japan, and the author of the Monolithic 3D book chapter in Chips 2020 Vol II.

At the IEEE S3S 2017 Or-Bach published a landmark paper titled: “A 1,000x Improvement in Computer Systems by Bridging the Processor Memory Gap” that leverages innovative monolithic 3D integration while using existing transistor and fab process.

Or-Bach has extensive management experience including being CEO and in charge of R&D, sales, marketing, business development and other corporate functions for over 40 years. Or-Bach has been an active board member of technology companies for over 20 years and is currently Chairman of the Board for Zeno Semiconductors and VisuMenu. Or-Bach has a history of innovative development in fast-turn ASICs for over 20 years. His vision led to the invention of the first Structured ASIC architecture, the first single via programmable array, and the first laser-based system for one-day Gate Array customization.

Prior to founding and running MonolithIC 3D since 2009, Or-Bach founded eASIC in 1999 and served as its CEO for six years. eASIC was funded by leading investors such as Vinod Khosla and KPCB, in three successive rounds. Under Or-Bach's leadership, eASIC won the prestigious EETimes' 2005 ACE Award for Ultimate Product of the year in the Logic and Programmable Logic category and the Innovator of the Year Award.

Earlier, Or-Bach founded Chip Express in 1989 (recently acquired by Gigoptix) and served as the company's president and CEO for almost 10 years, bringing the company to $40M revenue and recognition for four consecutive years as a high-tech Fast 50 Company.

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Zvi Or-Bach received his BSc degree (1975) cum laude in electrical engineering from the Technion – Israel Institute of Technology, and MSc (1979) with distinction in computer science, from the Weizmann Institute, Israel. He holds over 200 issued patents, primarily in the field of 3D integrated circuits and semi-custom chip architectures.