Dr. Martin Lonsky

Senior Process Integration Engineer - Sic Metallization at Nexperia

Dr. Martin Lonsky is a Senior Process Integration Engineer specializing in SiC metallization at Nexperia since October 2023, focusing on the sputter-deposition of metallic thin films on silicon and silicon carbide wafers. Prior to this role, Dr. Lonsky served as a research scientist at Goethe University Frankfurt, where the research concentrated on magnetic nanostructures and electronic transport properties in novel condensed matter systems, along with significant teaching involvement. Previous positions include a postdoctoral research associate at the University of Illinois at Urbana-Champaign working on magnetic thin films, and a postdoc at Johann Wolfgang Goethe-Universität Frankfurt am Main in experimental condensed matter physics. Dr. Lonsky earned a Ph.D. in Physics from Goethe University Frankfurt in 2018, following a Master of Science and Bachelor of Science in Physics from the same institution. Early professional experience includes serving as a teaching assistant and a retail cashier.

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