Ricardo Yandoc

Ricardo "Ding" Yandoc is an experienced technical professional in package and assembly engineering, currently serving as a Technical Director and Package & Assy Architect at Nexperia since February 2019. With a robust background in leading teams focused on package design and industrialization of various semiconductor products, including SiC, GaN, and MOSFETs, Ricardo has developed a comprehensive strategy for packaging solutions. Prior to Nexperia, Ricardo held multiple positions at NXP Semiconductors Manchester from 2004 to 2019, where responsibilities included managing new package introductions and maintaining close contact with assembly centers to address technical issues. Earlier career experience includes roles at Philips Semiconductors Philippines, Amkor Technology Philippines, and Plastic City Philippines, encompassing package development, equipment maintenance, and production supervision. Ricardo holds a BS in Electrical Engineering from Adamson University and participated in the Philips/NXP BU SP Talent Program.