Roee Barak is a Chip Design Engineer at NextSilicon since May 2022, with prior experience as a Logic Design Engineer at Amazon from March 2018 to April 2022. Roee also worked as a Software Developer at KELA Israeli Intelligence between November 2014 and October 2016, contributing to a company focused on leveraging intelligence techniques for business solutions. Roee holds a degree in Electronic Engineering & Physics from Tel Aviv University, obtained between 2015 and 2019.
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