Kabir Mirpuri

Kabir Mirpuri possesses extensive experience in engineering and product development, with a focus on integrated circuit packaging and materials. At NXP Semiconductors, Kabir served as a Senior Principal Engineer, qualifying high precision analog products and contributing significantly to the company's industrial roadmap, followed by a role as Principal Engineer supporting various product segments. Prior experience includes a Director position at Amkor Technology, managing IC package development for next-generation products, and a decade at Intel Corporation, where Kabir advanced to a Staff IC Packaging Engineer role, leading teams to deliver innovative packaging solutions for cutting-edge technology nodes. Kabir earned a Ph.D. from McGill University.