NY CREATES
Jill Arvindbhai Patel is a skilled Packaging Design Engineer at NY CREATES since August 2020, specializing in the design of masks for wafer bump designs and developing application-specific PCB boards for customized photonics dies, enhancing performance and reliability. Previously, Jill served as a Process I/C Design Engineer at Delta Circuits Inc., where responsibilities included designing schematics and layouts for RF and high-speed printed circuit boards while conducting necessary design checks. Jill's academic background includes a Master of Science in Electrical Engineering from the University of Missouri-Kansas City and a Bachelor's degree in Electrical, Electronics, and Communications Engineering from Silver Oak College of Engineering & Technology. Early research work involved innovative image edge detection techniques during roles as a Student Assistant and Research Assistant.
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NY CREATES
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The New York Center for Research, Economic Advancement, Technology, Engineering, and Science (NY CREATES) is a world-leading R&D innovation hub and commercialization facilitator. NY CREATES works with researchers in industry, academia, and national labs to leverage its state-of-the-art semiconductor-focused capabilities and resources spanning upstate New York and foster impactful partnerships with NY CREATES’ R&D teams through the ideation, incubation, and investment phases of technology development. NY CREATES continues New York’s long-standing leadership in providing an invigorating environment for high technology industries. This has enabled the establishment of the IBM AI Hardware Center, TEL Technology Center, America, LLC, Applied Materials’ META Center, Danfoss’s power electronics packaging facility, Wolfspeed’s 200mm Silicon Carbide (SiC) fab, and GlobalFoundries’ flagship fab in Malta, NY, among others. NY CREATES’ high-tech infrastructure includes the Albany NanoTech Complex, a 300mm wafer fab facility at Albany that represents more than $15B of capital investment by government and commercial entities over nearly three decades as the world’s most advanced, publicly owned semiconductor research and development site in the Western Hemisphere. The Test, Assembly and Packaging facility at Rochester, NY, is working with customers on electronic and photonic device packaging, including those for quantum computing, complementing facilities and partnerships across New York State that are catalyzing next-gen technologies, while fostering economic advancement opportunities to generate the jobs of tomorrow. Boasting more than 2,700 industry experts and faculty, NY CREATES manages total public and private investments of more than $20 billion – placing it at the global epicenter of high-tech innovation and commercialization. Learn more at www.ny-creates.org.