Masood Murtuza

Masood Murtuza: Masood is the Manager of Package Engineering at Octavo Systems. Prior to joining Octavo he was a Technical Fellow at Texas Instruments where he held multiple leadership roles in the Packaging and Assembly Process Engineering teams. During his tenure at TI he introduced a number of new semiconductor packaging technologies. He also helped advance innovation in technology development across the company by establishing new methodologies in package and assembly development process.

Masood holds 25 patents from his work prior to joining Octavo Systems. Since joining Octavo, he has been part of more than 10 patent applications on System in Package technology. He has authored or co-authored more than 15 papers in the areas of semiconductor packaging and System in Package technology.

He received his BTech in Mechanical Engineering from the Indian Institute of Technology, Madras, India and an MSc in Naval Architecture from University College, University of London.