Aarief Syed

Aarief Syed is a seasoned professional in the field of electronics packaging and power electronics, currently serving as Senior Manager of Packaging Development & Engineering at onsemi since March 2024. Previously, Aarief held the position of Head of Engineering Services at Heraeus Electronics from June 2022 to February 2024, overseeing engineering teams for global customer projects and focusing on prototype and process development, particularly in WBG integration and high-temperature operations. With experience extending back to roles at Heraeus Deutschland GmbH & Co. KG and other academic institutions, Aarief has contributed significantly to the advancement of power electronics technologies. Educational qualifications include a Doctor of Engineering from FAU Erlangen-Nürnberg, a Master of Science in Electrical Engineering from Otto-von-Guericke University Magdeburg, and a Bachelor's in Engineering from GITAM University.