Muhammad Tarmizi is a Senior Process Engineer at onsemi since March 2019, specializing in Molding and Trim & Form processes, with experience managing small discrete packages such as SOT223, SOT23A, TSOP5/6, and various others. Prior to this role, Muhammad Tarmizi worked as a Process Engineer at Infineon Technologies from August 2014 to February 2019, focusing on Molding and Tie Bar Cut processes and enhancing mold yield for power packages TO220 and TO263. Muhammad Tarmizi holds a degree in Electrical Engineering with a focus on Control, Instrumentation & Automation from Universiti Teknikal Malaysia Melaka, earned between 2010 and 2014.
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