Olaf Zschieschang

Olaf Zschieschang is an experienced professional in semiconductor packaging and development, currently serving as Director of Package Technology in Corporate Research and Development at onsemi since October 2016. Prior to this role, Zschieschang held the position of Director of Packaging at Fairchild Semiconductor from February 2012 to October 2016, and was involved in Power Module Development at IXYS Corporation from January 1992 to January 2012. Zschieschang earned a degree from the University of Applied Sciences Mittweida between 1986 and 1991.