Outsight
Sébastien Boutet's work experience begins in 2002 at STEPMIND as a DSP Firmware Engineer and continues in 2004 at Texas Instruments as a Modem Firmware Engineer. In 2004, they also joined Intel Corporation as a 2.5G & Audio Firmware Engineer. At Intel, they went on to become a Staff Firmware Engineer and then a Senior Staff Engineer. In 2017, Sébastien joined Sequans Communications as a Senior Firmware Engineer and later became a Firmware Technical Leader. Sébastien also served as a Technical Project Manager at Sequans from 2018 to 2020. In 2020, Sébastien joined Bosch as an SW Project Lead. Currently, they are working at Outsight as an R&D Software Engineer and Software Director since 2021.
Sébastien Boutet obtained a Master's degree in General Physics from Université de Tour Grandmont in the years 1997 to 2000. Following this, they pursued an Engineering Degree in Digital Signal Processing and Telecom from École supérieure d'ingénieurs de Nice Sophia-Antipolis from 2000 to 2002.
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Outsight
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Outsight develops a revolutionary kind of sensor, a 3D Semantic Camera that brings Full Situation Awareness to Smart Machines. This sensor combines software and hardware, to create sensor innovations such as remote material identification with comprehensive real-time 3D data processing. This technology provides an unprecedented and cost efficientability for systems to perceive, understand and ultimately interact with their surroundings in real time.Outsight believes in making a smarter and safer world by empowering cars, drones and robots with the superhuman capabilities provided by their 3D Semantic Camera. Their international team of scientists and engineers operates out of Paris, Helsinki and San Francisco.In July 2019, the company entered a new phase with its founders joining Cédric Hutchings (co-founder of Withings) and Scott Buchter (co-founder of Lasersec) to create a new entity, Outsight, based in Paris, San Francisco and Helsinki. This new entity aims to combine the software assets of Dibotics with a new and revolutionary 3D sensor technology.