Kun Hou

Kun Hou is an experienced Principal Process Engineer at PacBio, serving since September 2016. Previously, Kun held various engineering roles at SanDisk® for over eight years, including Staff Process Engineer and on-site manager at IMEC, where significant contributions were made to advanced memory development projects. Notable achievements include the development and transfer of 3D ReRAM technology and the integration of memory cell and selector devices for 3D storage class memory. With a strong academic background, Kun holds a PhD in Materials Science and Engineering from William & Mary and a Master's degree from Zhejiang University.