William Chung

Business Development Lead at Pack-Smart Inc. Automation

William Chung is a seasoned professional with extensive experience in engineering and business development. Currently serving as Business Development Lead at PACK-SMART INC. AUTOMATION since November 2022, William excels in establishing client relationships, delivering presentations, and coordinating cross-functional teams. Previously at Husky Technologies, notable roles included Product Specialist and Senior Project Engineer, where William developed product propositions and technical solutions. Earlier experiences include Senior Project Engineer and Project Engineer positions at Vesuvius USA, focusing on flow control products and technical expertise. William holds a Master of Applied Science and a Bachelor of Applied Science in Mechanical Engineering from the University of Waterloo.

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