Beat Rupp

Beat Rupp has an extensive work experience in various roles within the packaging industry. Beat has worked as the CEO of PackSys Global AG since May 2019, where they focus on designing and manufacturing specialized equipment for the packaging industry. Prior to that, they were the CEO of Hapa AG from May 2014 to April 2019, overseeing strategic and operational planning for the company.

Beat Rupp also has a background in the Swiss Armed Forces, where they served as a Stab LW from 2015 to 2019 and as part of the Flab/Ground Based Air Defence from 1989 to 2015. Additionally, they previously worked as the Managing Director of PackSys Global (Switzerland) Ltd. from April 2006 to April 2014 and as the Technical Director of PackSys Global Ltd. from February 2002 to March 2006.

Beat Rupp has a diverse education history. In 1988, they completed their high school education at Gymnasium Köniz. Later, they pursued a Master's Degree in engineering with a focus on microtechnique at EPFL (École polytechnique fédérale de Lausanne). The specific duration of their studies at EPFL is unknown. Afterward, in 1999, they attended ETH Zürich and obtained a Master of Business Administration (M.B.A.) degree, specializing in industrial management and manufacturing. In 2014, they completed the SKU Management Programm in Switzerland, where they received a SKU Diploma/Certificate in management, business administration, leadership, and strategy.