PHIX Photonics Assembly
Fabio Domingues Caetano is a seasoned professional in photonic engineering and semiconductor packaging, currently serving as Project Leader in Photonic Engineering at PHIX Photonics Assembly since March 2024. Prior to this role, Fabio spent nearly 14 years at Eldorado Research Institute as R&D IC Packaging Project Manager, overseeing a multidisciplinary team in the Semiconductor Packaging Laboratory focused on heterogeneous packaging processes. Fabio holds a Master in Business Administration with a specialization in Project Management from USP/Esalq, completed in December 2021, and a Bachelor’s Degree in Electrical Engineering from Universidade de São Paulo, obtained in 2010.
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PHIX Photonics Assembly
PHIX is a world leading packaging and assembly foundry for Photonic Integrated Circuits (PICs), building optoelectronic modules based on all major PIC technology platforms (such as Indium Phosphide, Silicon Photonics, Silicon Nitride, and Planar Lightwave Circuit) in scalable manufacturing volumes. We specialize in chip-to-chip hybrid integration, coupling to fiber arrays, and interfacing of DC and RF electrical signals. By offering our knowledge already at the chip design stage, we ensure ease of scale-up for volume manufacturing and provide a one-stop-shop for PIC and MEMS assembly. #siliconphotonics #hightechindustry #microassembly #mems #optoelectronics #photonics #opticalfiber