Hanna Luusua

Product Manager at PiBond

Hanna Luusua is a skilled chemist with a strong background in microelectronics and battery research. Currently a project leader at PiBond since November 2019, Hanna oversees R&D and commercialization projects related to enabling materials. Previous experience includes a Master's Thesis Worker role at VTT, focusing on aging mechanisms in lithium-ion batteries, and a Research Trainee position involving experimental battery testing. Hanna's early career features various roles, including a trainee at Vaisala, a course assistant at Aalto University, and personal assistance for individuals with disabilities. Educational qualifications include a Master’s degree in Chemistry and a Bachelor of Science in Chemical Engineering from Aalto University, complemented by a Bachelor of Engineering in Health Technology from Metropolia University.

Location

Espoo, Finland

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PiBond

Pibond is manufacture a broad range of unique electronic materials,which meets customers' stringent performance and integration requirements. We currently supply materials from all of our product lines to leading foundries in the world.We specialize in the development and production of advanced siloxane and metal oxide monomers and polymers.Many of the products we manufacture are essential in construction of new, next generation of devices, or helping to reduce our customer’s production costs and improving quality. Our materials are currently being used by customers at multiple nodes including “10 nm class” advanced semiconductor devices.The expertise we have in product development, application engineering and state-of-the-art production techniques ensures fast time to market for customers, delivering the performance required for even the most advanced device designs.Apart from being used at multiple nodes within the semiconductor industry, Pibond also offers and develops materials for MEMS and Advanced IC Packaging. Industrial trends like The Internet of Things are increasing the demands for Wafer Level and emerging 3D-IC packaging architectures.


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Headquarters

Espoo, Finland

Employees

11-50

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