PiBond
Heli Kekkonen started their work experience in 2014 as a Quality Controller at Metsä Wood. Heli then worked at Murata in 2016 as an Operator for a few months. From 2017 to 2017, they worked as a Trainee at ABB. In 2018, they became a Production Supervisor Trainee at ABB and later had a role as a Trainee in the same company. In 2019, they joined Sweco as a Project Coordinator until 2022. Currently, they work at PiBond as a Process Engineer starting in 2022.
Heli Kekkonen began their education in 2012 at Luksia, Western Uusimaa Municipal Training and Education Consortium, where they pursued a vocational upper secondary qualification in Laboratory Technology. Heli completed their studies in 2015.
In 2015, Heli enrolled at Metropolia University of Applied Sciences and embarked on a Bachelor of Engineering (BE) degree in Chemical Engineering. Their studies at this institution lasted for four years, until 2019, when they successfully obtained their bachelor's degree.
Additionally, in 2018, Heli briefly attended Glasgow Caledonian University where they pursued a Bachelor of Applied Science (BASc) degree in Forensic Investigation. This program lasted for a year and contributed to their academic pursuits.
Based on the provided information, Heli Kekkonen has a background in Laboratory Technology, Chemical Engineering, and Forensic Investigation.
PiBond
Pibond is manufacture a broad range of unique electronic materials,which meets customers' stringent performance and integration requirements. We currently supply materials from all of our product lines to leading foundries in the world.We specialize in the development and production of advanced siloxane and metal oxide monomers and polymers.Many of the products we manufacture are essential in construction of new, next generation of devices, or helping to reduce our customer’s production costs and improving quality. Our materials are currently being used by customers at multiple nodes including “10 nm class” advanced semiconductor devices.The expertise we have in product development, application engineering and state-of-the-art production techniques ensures fast time to market for customers, delivering the performance required for even the most advanced device designs.Apart from being used at multiple nodes within the semiconductor industry, Pibond also offers and develops materials for MEMS and Advanced IC Packaging. Industrial trends like The Internet of Things are increasing the demands for Wafer Level and emerging 3D-IC packaging architectures.