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Kimmo Karaste

Senior Manager, Process Integration at PiBond

Kimmo Karaste has extensive work experience in the semiconductor industry. Kimmo started their career at Micro Analog Systems as a Trainee in 2001. Kimmo then joined Silecs Oy in 2003 and held various positions including Process Engineer, Senior Process Engineer, and Team Leader until 2011. In 2011, they joined Murata Electronics Oy as a Process Development Technology Specialist, where they worked until 2016. Kimmo then moved on to PiBond in 2016, where they assumed the role of Senior Manager, Process Integration. In 2017, they joined Okmetic Oy as a Lithography Consultant, where they worked until the end of the year.

Kimmo Karaste has a Bachelor of Engineering degree in Electronics from Metropolia University of Applied Sciences. Kimmo also holds a Master of Science degree in Electronics, Communication, and Automation from Aalto University, which was completed in 2010.

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PiBond

Pibond is manufacture a broad range of unique electronic materials,which meets customers' stringent performance and integration requirements. We currently supply materials from all of our product lines to leading foundries in the world.We specialize in the development and production of advanced siloxane and metal oxide monomers and polymers.Many of the products we manufacture are essential in construction of new, next generation of devices, or helping to reduce our customer’s production costs and improving quality. Our materials are currently being used by customers at multiple nodes including “10 nm class” advanced semiconductor devices.The expertise we have in product development, application engineering and state-of-the-art production techniques ensures fast time to market for customers, delivering the performance required for even the most advanced device designs.Apart from being used at multiple nodes within the semiconductor industry, Pibond also offers and develops materials for MEMS and Advanced IC Packaging. Industrial trends like The Internet of Things are increasing the demands for Wafer Level and emerging 3D-IC packaging architectures.


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Headquarters

Espoo, Finland

Employees

11-50

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