PiBond
Nailin Yu has a diverse work experience in the field of technical sales, marketing, and engineering. Currently, Nailin works as a Senior Technical Sales Manager at PiBond since July 2021. Prior to this, Nailin served as the Manager of Marketing & Sales at Tokyo Ohka Kogyo Co Ltd starting in September 2015. Before that, Nailin was an Application Engineer at Ultratech - a Division of Veeco from May 2011 to August 2015. Nailin began their career as a Lithography process engineer at ASMC, where they worked from May 2006 to May 2011.
Nailin Yu completed their Bachelor of Engineering (BEng) degree in electronics engineering from Shanghai University, attending from 2001 to 2005. Nailin then pursued further education and obtained a Master of Engineering (MEng) degree in integrated circuit engineering from Shanghai Jiao Tong University, where they studied from 2009 to 2013.
This person is not in any offices
PiBond
Pibond is manufacture a broad range of unique electronic materials,which meets customers' stringent performance and integration requirements. We currently supply materials from all of our product lines to leading foundries in the world.We specialize in the development and production of advanced siloxane and metal oxide monomers and polymers.Many of the products we manufacture are essential in construction of new, next generation of devices, or helping to reduce our customer’s production costs and improving quality. Our materials are currently being used by customers at multiple nodes including “10 nm class” advanced semiconductor devices.The expertise we have in product development, application engineering and state-of-the-art production techniques ensures fast time to market for customers, delivering the performance required for even the most advanced device designs.Apart from being used at multiple nodes within the semiconductor industry, Pibond also offers and develops materials for MEMS and Advanced IC Packaging. Industrial trends like The Internet of Things are increasing the demands for Wafer Level and emerging 3D-IC packaging architectures.