PiBond
Sams Hsu has extensive work experience in various roles related to sales and service engineering. Sams started their career in 2000 at Hermes-Epitek Corp. Inc as a Service and Application Engineer, where they were responsible for ion implanter service and process. Sams also worked on the development and testing of the Ion Implanter plan and had the first install base in UMCi. Additionally, they conducted studies on shallow junction and RTP processes.
In 2003, Sams joined KLA-Tencor as a Service Engineer, where they were responsible for CD-SEM and film measurement tool service. Sams achieved KLA service engineer Level 3 certification on CD-SEM and FX system and was assigned as the TSMC account service engineer, in charge of service on TSMC F8 and F12.
In 2006, Sams joined Brooks Automation as a Sales Manager. Sams was responsible for all of Brooks product sales and managed key accounts such as UMC, Formosa, PSC, Rexchip, Winbond, and backend fabs. Sams held this role until 2015.
From 2015 to 2017, Sams worked at Genestech as a Sales Director (China), overseeing sales operations. Then, in 2017, they joined PiBond as a Senior Sales Director, where they currently work.
Overall, Sams Hsu's work experience demonstrates their expertise in sales and service engineering roles within the semiconductor industry.
Sams Hsu holds a Master's degree in Civil Engineering from TamKang University, which they obtained from 1995 to 1997. Prior to that, from 1987 to 1992, they earned a Diploma of vocational school in Mechanical Engineering from the National Yunlin Institute of Technology. Additionally, they hold a Bachelor's degree in Civil Engineering from the Diploma of vocational school National Yunlin Institute of Technology, although the specific years of study for this degree were not provided.
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PiBond
Pibond is manufacture a broad range of unique electronic materials,which meets customers' stringent performance and integration requirements. We currently supply materials from all of our product lines to leading foundries in the world.We specialize in the development and production of advanced siloxane and metal oxide monomers and polymers.Many of the products we manufacture are essential in construction of new, next generation of devices, or helping to reduce our customer’s production costs and improving quality. Our materials are currently being used by customers at multiple nodes including “10 nm class” advanced semiconductor devices.The expertise we have in product development, application engineering and state-of-the-art production techniques ensures fast time to market for customers, delivering the performance required for even the most advanced device designs.Apart from being used at multiple nodes within the semiconductor industry, Pibond also offers and develops materials for MEMS and Advanced IC Packaging. Industrial trends like The Internet of Things are increasing the demands for Wafer Level and emerging 3D-IC packaging architectures.