PiBond
Zhongmei Han began their work experience as a Process Engineer at PiBond in September 2021. Prior to this, they worked at the University of Helsinki from September 2011 to October 2018, where they specialized in FIB patterning of ALD thin films.
Zhongmei Han has an extensive educational background in the field of science and engineering. Zhongmei pursued their Bachelor's Degree in Applied Chemistry at Suzhou University of Science and Technology from 2002 to 2008. Following this, they furthered their studies and obtained a Master's Degree in Optical Engineering at Zhengzhou University from 2008 to 2011. Finally, they completed their highest level of education at the University of Helsinki, where they earned a Doctor of Philosophy (PhD) in Materials Science between the years 2011 and 2018.
This person is not in any offices
PiBond
Pibond is manufacture a broad range of unique electronic materials,which meets customers' stringent performance and integration requirements. We currently supply materials from all of our product lines to leading foundries in the world.We specialize in the development and production of advanced siloxane and metal oxide monomers and polymers.Many of the products we manufacture are essential in construction of new, next generation of devices, or helping to reduce our customer’s production costs and improving quality. Our materials are currently being used by customers at multiple nodes including “10 nm class” advanced semiconductor devices.The expertise we have in product development, application engineering and state-of-the-art production techniques ensures fast time to market for customers, delivering the performance required for even the most advanced device designs.Apart from being used at multiple nodes within the semiconductor industry, Pibond also offers and develops materials for MEMS and Advanced IC Packaging. Industrial trends like The Internet of Things are increasing the demands for Wafer Level and emerging 3D-IC packaging architectures.