Ryan Shook is an experienced professional with a strong background in packaging engineering and sales management. Currently serving as Regional Sales Manager at Placon Corporation since May 2019, Ryan has held key positions in notable companies such as Abbott and Amcor Flexibles Europe & Americas, where responsibilities included senior roles in packaging engineering and account management. With foundational experience at Boston Scientific and IBM, Ryan possesses a robust understanding of packaging processes and product launches. Academic credentials include an MBA in Finance and a Master’s in Business Management Administration from Hamline University, as well as a BS in Packaging Engineering and a Bachelor of Applied Science in Packaging Science from the University of Wisconsin-Stout.
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