Ron Minkovsky

Senior Director Of Technical Sales at Pliops

Ron Minkovsky has a diverse work experience spanning multiple companies. Ron started their career in 2007 as a HW Engineer at NSN. Ron then worked as a HW Engineer at modu from 2008 to 2010 before joining ECI Telecom as a HW Engineer from 2010 to 2012. Ron then transitioned to Samsung, where they held various roles. At Samsung Israel Research Center (SIRC), they worked as a Field Application Engineer for Samsung's imaging devices from 2012 to 2016, and later as a Team Manager of Application Engineering & Image Quality, managing a large team and leading image quality activities for CIS products. Currently, Ron is working at Pliops, where they started in 2020 as a Senior Director of Customer Success and later transitioned to the role of Senior Director of Technical Sales in May 2022.

Ron Minkovsky pursued their education at Tel Aviv University, where they obtained a Master of Business Administration (M.B.A.) degree in Finance, General. Ron enrolled in this program from 2010 to 2014. Prior to their MBA, Ron completed their undergraduate studies at the same university from 2002 to 2006. During this time, they specialized in Electrical and Electronics Engineering.

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Pliops

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Today’s explosive data growth and rapidly expanding application workloads threaten to overwhelm datacenters, preventing organizations from harnessing AI/ML, 5G, big data analytics, IoT, and other modern applications they need to achieve their business goals. Accelerating these data-hungry, storage-intensive applications requires more application speed, storage capacity, data efficiency, and scalability than most organizations can afford, no matter how many CPUs and SSDs they add, or how much they expand their datacenter footprint. Just as GPUs overcome processing inefficiencies to accelerate artificial intelligence and advanced analytics performance, the breakthrough Pliops Extreme Data Processor (XDP) overcomes storage inefficiencies to massively accelerate performance and dramatically reduce overall infrastructure costs for databases, analytics, and machine learning. Delivered on an easy-to-deploy, low-profile PCIe card, the Pliops XDP radically simplifies the way data is processed and flash storage is managed. The result is an exponential increase in performance, reliability, capacity, and efficiency— multiplying the effectiveness of organizations’ infrastructure investments. Pliops multiplies the effectiveness of organizations’ infrastructure investments by exponentially increasing datacenter performance, reliability, capacity, and efficiency. Delivered on an easy-to-deploy, low-profile PCIe card, the breakthrough Pliops Extreme Data Processor (XDP) radically simplifies the way data is processed and flash is managed. Pliops overcomes storage inefficiencies to massively accelerate performance and dramatically reduce overall infrastructure costs for data-hungry, storage-intensive applications such as AI/ML, 5G, big data analytics, and IoT. Founded in 2017 and named as one of the 10 hottest semiconductor startups by CRN in 2020, Pliops has raised $115M to date from leading investors. Learn more at www.pliops.com.


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