Promex Industries Inc.
Jeannine Serbanich is a seasoned finance professional with extensive experience in various leadership roles. Currently serving as VP of Finance at Promex Industries Inc. since October 2024, Jeannine previously held the position of VP of Finance and Accounting at Lull from August 2022 to October 2024. Prior to that, Jeannine was the Financial Controller at HERBL Distribution Solutions from February 2020 to August 2022. Jeannine's career includes significant experience at Curvature, where a role spanned from December 2006 to January 2020, managing financial planning, analysis, and global accounting processes. Earlier positions include Controller and Accounting Manager at Santa Barbara Staffing & NCC Recruiting and Diving Director/SCUBA Instructor at Guided Discoveries, reflecting a diverse skill set rooted in finance and operational management.
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Promex Industries Inc.
MICROELECTRONICS ASSEMBLY SERVICES / HIGH RELIABILITY SMT-PCBA / IC ASSEMBLY & ADVANCED PACKAGING / CUSTOM PROCESS DEVELOPMENT • Medical Microelectronics Process Development & Assembly • IC & Advanced Packaging • Military / ITAR Production • High Reliability SMT / PCBA Promex, located in Silicon Valley, is an ISO 13485 Medical and ISO 9001 certified microelectronics, semiconductor & advanced packaging and high reliability SMT/PCBA contract assembly service provider for the medical & bioscience, commercial and military markets. Core competencies allow the sequential steps of prototypes, new product introductions & beta production, followed by volume manufacturing. Complete in-house microelectronics process capabilities and process expertise uniquely integrates SMT / PCBA with microelectronics assembly. Facilities include Class 100 and Class 1000 clean rooms, RoHS optimized SMT/PCBA lines, plus development & assembly areas. ISO 13485 Medical process verification and validation using IQ, OQ, PQ and pFMEA practices and extensive use of statistical process controls. Complete Microelectronics Assembly Process Flows: • Wafer handling and sawing including 300 mm wafers • Fully automatic die attach • Wire bonding (Au ball, Al wedge, RF ribbon & wedge) • Heterogeneous Integration (Multi-chip modules, arrays, system-in-package) • Precision materials dispense • Encapsulation • Flip Chip High Reliability SMT/PCBA and Chip-on-Substrate: RoHS optimized SMT lines allow single facility process integration. Leaded solder processing also available. Chip-on-Substrate expertise. IPC-A-610 Class 3 assembly. Consigned and full turnkey SMT/PCBA and supply chain management. Quality Systems (Medical): FDA Title 21 Part 820 compliance ensures device history files, operator training records, IQ, OQ, PQ and process documentation meet all standards.