Richa Verma

Richa Verma is a Sr Digital IC Design Engineer at Qorvo, Inc. since February 2023 and has been a Graduate Research Associate and Graduate Teaching Assistant at The Ohio State University since August 2017. Richa's background includes a Graduate Student role in the Department of Electrical and Computer Engineering at Ohio State University from September 2016 to January 2022, along with an internship as a Design Engineer Intern at Intel Corporation in the summer of 2017. Prior experience includes positions as a Senior Design Engineer at STMicroelectronics and as a Member Technical Staff at HCL Technologies, where responsibilities encompassed design documentation, development of test plans, and verification tasks. Richa began the engineering career as a Design Engineer at RF Silicon Technology Pvt. Ltd. The educational background includes a Master’s Degree in VLSI from Amity University Uttar Pradesh and an Engineer’s Degree in Electrical, Electronics and Communications Engineering from the University of Rajasthan. Currently seeking an internship position in the field of Electronics (VLSI).