Tae S Hwang

Tae S. Hwang has worked in a variety of roles since 2007. In 2021, they began their current role as Senior Staff Engineer at Qureator. From 2013 to 2012, they served as a Post-Doc at the University of Nevada Las Vegas and Sungkyunkwan University (SAINT), respectively. During this time, they conducted research on soft actuator, materials, metal plating, electrophoretic deposition, carbon base materials, and plasma polymerization. From 2007 to 2012, they were a Package Researcher at Hynix Semiconductor where they conducted research on flip chip package process, FBGA memory, and high capacity NAND flash memory.

Tae S. Hwang received their Bachelor of Engineering (B.E.) in Polymer/Plastics Engineering from Sungkyunkwan University in 2004. Tae S. then went on to earn a Master of Engineering (MEng) in Polymer/Plastics Engineering from the same university in 2007. Finally, they completed their Doctor of Philosophy (PhD) in Polymer/Plastics Engineering from Sungkyunkwan University in 2012.