DivyaSai Mandalapu

Field Application Engineer (wireless) at R3 Solutions

DivyaSai Mandalapu is currently working as a Field Application Engineer at R3 Solutions since January 2023. Prior to this, they worked on their Master Thesis at Fraunhofer Institute for Production Technology IPT from March 2022 to November 2022. Before completing their Masters in Electronics Engineering at HSB Hochschule Bremen – City University of Applied Sciences, from March 2019 to November 2022, they worked as a student assistant at the same institution. DivyaSai also holds a Bachelor of Technology in Electronics and Communication Engineering from Chebrolu Engineering College.

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Timeline

  • Field Application Engineer (wireless)

    January, 2023 - present