Rakon
Daniel Wei is an experienced engineering professional with a strong background in electronics and network solutions. Currently serving as a Custom Product Design Engineer at Rakon since November 2022, Daniel previously held roles as an Electronic Engineer at IMAGR and as a Network Solutions Consultant at Huawei Technologies, where responsibilities included providing comprehensive network solutions and managing project bids. Daniel's experience also encompasses working as a System Engineer at Huawei, focusing on microwave transmission planning and product technology design, as well as a Hardware Engineer at Comba Telecom, where contributions included the development of RF modules for 3G base stations. Daniel holds a Master's degree in Electrical and Electronics Engineering from The University of Auckland and a Bachelor's degree in Electrical, Electronics and Communications Engineering from the University of Electronic Science and Technology of China.