Rameen Hadizadeh

Rameen Hadizadeh is a seasoned professional in the field of packaging engineering with extensive experience across various companies. Currently serving as Senior Manager of Packaging at Rambus since February 2023, Rameen previously held the position of Manager of Package Development at Cirrus Logic from August 2019 to February 2023. Prior roles include Packaging Technology Manager at Wispry, Senior IC Packaging Engineer at Qualcomm, IC Packaging Engineer at Texas Instruments, Graduate Research Assistant at Georgia Institute of Technology, and Co-op Engineer at Sandia National Laboratories. Rameen holds a Master of Science in Mechanical Engineering from Georgia Institute of Technology and a Bachelor of Science in Mechanical Engineering from the University of Kentucky.